■Custom-designed Ultramid©Advanced N3U41 G6 products can enhance the robustness, long-term performance, and reliability of IGBTs.
■ Semikron Danfoss utilizes BASF PPA products as the Semitrans 10 IGBT housing material for its photovoltaic and wind energy systems' inverters.
For next-generation power electronic devices, BASF has developed a poly-p-phenylenediamine (PPA) material, which is particularly suitable for manufacturing the semiconductor housings for IGBTs. Ultramid®Advanced N3U41 G6 can meet the growing demand for high-performance, reliable electronic components in areas such as electric vehicles, high-speed trains, smart manufacturing, and renewable energy generation. As a global technology leader in power electronics, Semikron Danfoss currently uses BASF PPA as the Semitrans 10 IGBT housing material for its photovoltaic and wind power system inverters. Ultramid®Advanced N series exhibits excellent chemical resistance and dimensional stability, which can enhance the robustness, long-term performance, and reliability of IGBTs, thereby meeting the growing demands for energy efficiency, higher power density, and improved performance. IGBTs enable efficient switching and control in power electronic devices.
IGBT is a critical component in modern electronic devices, particularly in the field of renewable energy.
Research and Development Department, Jörn Grossmann, Semikron Danfoss states: "IGBTs must operate at higher temperatures while maintaining long-term stability and high performance. Thanks to the unique properties of BASF PPA material, Semitrans 10 has set new benchmarks for performance and efficiency. This material exhibits excellent electrical insulation performance even in harsh environments. Furthermore, it possesses excellent durability even during short-term temperature peaks during assembly. Therefore, we chose this material." The combination of high-performance materials and intelligent design can improve switching speed, reduce conduction losses, and optimize thermal management, thereby meeting the critical requirements of power electronic devices.
Currently, BASF's Ultradur is widely used in IGBTs.®(PBT: Polybutylene Terephthalate). In rapidly developing power electronic devices, the newly introduced PPA can meet the stringent requirements of the next generation IGBTs, such as the ability to withstand higher temperatures, maintain continuous electrical insulation performance, and maintain dimensional stability in challenging environments with moisture, dust, and dirt. Ultramid™ Advanced N3U41G6, a laser-sensitive, halogen-free, flame-retardant material, features excellent thermal stability, low water absorption, and outstanding electrical performance. Its key feature is a CTI (CTI=Relative Leakage Index) value of up to 600 (according to IEC 60112): This material has lower leakage and better insulation performance compared to materials currently used in power switches, which can further facilitate the miniaturization of IGBTs. UL-certified products have an electrical RTI (Relative Temperature Index) value of up to 150°C.
"BASF's Power Electronics Senior Application Expert, Jochen Seubert, stated: "BASF's PPA modified products are available globally and offer sample demonstrations. We provide technical support for component development, focusing on customer needs. We hope that this innovative material will make a significant contribution to the development of power electronics devices and accelerate the global transition to renewable energy."
In IGBT manufacturing, after the metal pins are molded with the fixture, BASF PPA is compatible with semiconductor packaging materials.